
B–63833EN/03
9. CONNECTION TO FANUC I/O Link
182
Ambient temperature
for the unit
Operation: 0°C to 55°C
Storage and transportation: –20°C to 60°C
Temperature change 1.1°C/minute maximum
Humidity Normal condition: 75% (relative humidity)
Short term (within one month): 95% (relative humidity)
Vibration Operation: 0.5 G or less
Atmosphere Normal machining factory environment (For use in an
environment with relatively high levels of dust, coolant,
organic solutions, and so forth, additional measures are
required.)
Other conditions (1) Use each I/O module in a completely sealed cabinet.
(2) For ventilation within each I/O module, each module
must be installed in the orientation shown below.
Moreover, for ventilation and wiring, allow a
clearance of 100 mm or more above and below each
module. Never place a device that generates a large
amount of heat below an I/O module.
(3) While referring to Section 9.6.17, ensure that the vent
hole of the basic module is not obstructed by the flat
cable.
Upper side
I/O Link connection
MPG connection
Basic module
Expansion
module 1
Expansion
module 2
Expansion
module 3
Lower side
Module Power supply
voltage
Power supply
rating
Remarks
Basic module
24 VDC "10% is fed
through the I/O
0.2A+7.3mA DI Number of DI
points with DI=ON
Expansion
modules A
and B
connector (CB150) of
the basic module;
"10% includes
momentary variations
0.1A+7.3mA DI Number of DI
points with DI=ON
Expansion
module C
(2A module)
and ripples.
0.1A
Expansion
module D
(analog input
module)
0.1A
As a guideline for the heat dissipation, assume [power supply capacity
24 (W)].
Installation conditions
Power supply rating